• Process Applications:

  • Firing and annealing of multi-layer chip capacitors
  • Sintering
  • Brazing
  • Metalizing
  • Calcining
  • Other high-temperature controlled atmosphere applications

• General Application Parameters:

  • Maximum Temperature Rating: 1450 ℃
  • Atmosphere System: Air, nitrogen, hydrogen, and other atmospheres. Comprehensive dual burn-off safety system for hydrogen applications.
  • Heating Method: Silicon carbide heating bars.
  • Cooling Modules: Free and forced convection/conduction. Both air and water available as standard equipment.
  • Clearance above Conveyor Belt: 1-4 inches (25-101mm).
  • Transport Widths: 6-24 inches (150-610mm).

Advantages

• Precise Temperature Stability
• Precise Gas Flow Programming
• Multiple Atmospheres with Humidifiers
• Energy and Space Saving Efficiency
• Unmatched Innovation and Performance
• Fully automated closed loop Pusher Plate Return System