1500 Series

• Thick film firing of noble metals
• Low Temperature Cofired Ceramic (LTCC)
• Glass annealing
• Other high-temperature air atmosphere applications

2500 Series

• Thick film firing of noble metals
• Copper thick film firing
• Low Temperature Cofired Ceramic (LTCC)
• Glass-to-metal sealing
• Brazing
• Reducing
• Other high-temperature controlled atmosphere applications

3500 Series

• Lead and lead-free solder reflow
• BGA reflow
• Wafer bumping
• Assembly
• Package Sealing
• Other solder reflow applications

4500 Series

• Curing/Drying of encapsulants, underfills, inks, and films
• Other low-temperature air atmosphere applications

7500 Series

• Thick film firing
• Flip-chip/solder bump reflow
• Epoxy curing
• Drying
• Other high-temperature applications

8500 Series

• Low-temperature Co-fired Ceramic (LTCC)
• Other high-temperature long-cycle air atmosophere applications

9500 Series

• Firing and annealing of multi-layer chip capacitors
• Sintering
• Brazing
• Metalizing
• Calcining
• Other high-temperature controlled atmosphere applications